Solder behavior and defect formation in joining process by Al/Ni self-propagating reaction.
| Autor: | Zhu, Wenbo, Wu, Fengshun, Xia, Weisheng, Wang, Baihui, Wang, Paul, Hou, Eric |
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| Zdroj: | 2013 14th International Conference on Electronic Packaging Technology; 2013, p1-5, 5p |
| Databáze: | Complementary Index |
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