Detecting buried voids in copper interconnect.
| Autor: | Liao, Hsiang-Chou, Tuung Luoh, Ling-Wu Yang, Tahone Yang, Kuang-Chao Chen, Chih-Yuan Lu, Steve Lin, Cheng, Alex, Yao, Ivan, SiYeul Yoon, Moreau, Olivier, Xiao, Hong |
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| Zdroj: | 2013 e-Manufacturing & Design Collaboration Symposium (eMDC); 2013, p1-4, 4p |
| Databáze: | Complementary Index |
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