ClaritasTM — A unique and robust endpoint technology for silicon drie processes with open area down to 0.05%.
| Autor: | Ansell, Oliver, Barnett, Richard, Haase, Thomas, Xie, Ling, Vargo, Steve, Thomas, Dave |
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| Zdroj: | 2014 IEEE 27th International Conference on Micro Electro Mechanical Systems (MEMS); 2014, p459-462, 4p |
| Databáze: | Complementary Index |
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