Glass interposer substrates: Fabrication, characterization and modeling.
| Autor: | Keech, John, Piech, Garrett, Pollard, Scott, Chaparala, Satish, Shorey, Aric, Wang, Bor Kai |
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| Zdroj: | 2013 IEEE 15th Electronics Packaging Technology Conference (EPTC 2013); 2013, p706-709, 4p |
| Databáze: | Complementary Index |
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