Process development of 10μm pitch Cu-Cu low temperature bonding for 3D IC stacking.
| Autor: | Xie, Ling, Wickramanayaka, Sunil, Li, Hongyu, Jung, Boo Yang, Aw, Jie Li, Chong, Ser Choong |
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| Zdroj: | 2013 IEEE 15th Electronics Packaging Technology Conference (EPTC 2013); 2013, p493-497, 5p |
| Databáze: | Complementary Index |
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