Investigation of dynamic and mechanical thermal behavior of isotropic conductive adhesives.
| Autor: | Durairaj, R., Sean, Chew Chee, Chiun, Tan Chia, Ping, Liew Jian |
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| Zdroj: | 2013 IEEE 15th Electronics Packaging Technology Conference (EPTC 2013); 2013, p461-465, 5p |
| Databáze: | Complementary Index |
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