Chip to chip hermetic bonding and multi-chip stacking using CuSn bonding technology.
| Autor: | Sekhar, V. N., Su, Lee Jun, Toh Wai Hong, Justin See, Bangtao, Chen |
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| Zdroj: | 2013 IEEE 15th Electronics Packaging Technology Conference (EPTC 2013); 2013, p135-138, 4p |
| Databáze: | Complementary Index |
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