Chip Package Interaction(CPI) risk assessment on 28nm Back End of Line(BEOL) stack of a large I/O chip using compact 3D FEA modeling.
| Autor: | Shah, Chirag, Mirza, Fahad, Premachandran, C S |
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| Zdroj: | 2013 IEEE 15th Electronics Packaging Technology Conference (EPTC 2013); 2013, p93-97, 5p |
| Databáze: | Complementary Index |
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