| Autor: |
Chew, Jason, Mahajan, Uday, Bajaj, Rajeev, Mirshad, Iad, Newcomb, Robert |
| Zdroj: |
2013 IEEE International 3D Systems Integration Conference (3DIC); 2013, p1-6, 6p |
| Abstrakt: |
Through Silicon Vias (TSV) is a key technology for advanced 3DIC packaging, enabling improved device performance, integration of multiple functions in a single package and form factor reduction. TSV reveal CMP is one of the key processes in this integration scheme [1]. [ABSTRACT FROM PUBLISHER] |
| Databáze: |
Complementary Index |
| Externí odkaz: |
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