| Autor: |
Tews, D., Michalik, F., Haidar, R., Thoms, M., Goh, Mengliau, Li, Simon |
| Zdroj: |
2013 8th International Microsystems, Packaging, Assembly & Circuits Technology Conference (IMPACT); 2013, p31-34, 4p |
| Abstrakt: |
The technological development of new gadgets is a competitive race that consists of a continuous striving for additional features, higher performance and cost minimization. These needs drive the permanent requirement for new and revolutionary developments, especially in the IC-packaging industry. In this paper, findings from the development of a Non Etching Adhesion Promoter (NEAP) process, specifically for dry film pretreatment, are described and discussed. It also outlines detailed results that were obtained on process performance and the clear benefits to the industry of this new and innovative approach. [ABSTRACT FROM PUBLISHER] |
| Databáze: |
Complementary Index |
| Externí odkaz: |
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