| Autor: |
Duan, P., Raz, O., Smalbrugge, B. E., Duis, J., Dorren, H.J.S |
| Zdroj: |
2012 38th European Conference & Exhibition on Optical Communications; 2012, p1-3, 3p |
| Abstrakt: |
High speed, high density and low cost solution for realizing optical interconnects is presented. An opto-electronic die, directly bonded on top of CMOS IC driver, is connected using metal traces lithographically defined. A twelve channel transmitter based on the technique was fabricated, and test shows good performance up to 12.5 Gb/s/ch. [ABSTRACT FROM PUBLISHER] |
| Databáze: |
Complementary Index |
| Externí odkaz: |
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