| Autor: |
Yuan, Weiliang, Kim, SungJoo, Ryu, Woong Hwan, Moon, SeongJae, Lee, Sangmin |
| Zdroj: |
2013 IEEE 22nd Conference on Electrical Performance of Electronic Packaging & Systems; 2013, p159-162, 4p |
| Abstrakt: |
Probing solution is crucial for the designs and validation of high-speed PoP devices in high-performance mobile application processor (AP) development, where PoP assembly technology is used to achieve high data throughput & low cost. The paper has developed robust PoP probing solution for AP product development based on microwave network theory, including probe loading effect minimization, probing channel propagation removal, waveform reconstruction at die pad and interposer/socket de-embedding, which are applied to the latest mobile application processor development. It is also straight forward and natural to extend the developed methods to TSV-based devices with WideIO interface. [ABSTRACT FROM PUBLISHER] |
| Databáze: |
Complementary Index |
| Externí odkaz: |
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