| Autor: |
Ning, Honglong, Ma, Usheng, Huang, Fuxiang, Wang, Yonggang, Zhu, Jiman, Zhiting, Geng |
| Předmět: |
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| Zdroj: |
Surface Review & Letters; Feb2003, Vol. 10 Issue 1, p95, 5p |
| Abstrakt: |
DCB means direct copper bonding and denotes a process in which copper and a ceramic material are directly bonded. Between the temperature of the metal's melting point and the eutectic temperature of the metal-oxygen, DCB depends on the eutectic compound to join the copper and the ceramic. We do some research to investigate the interface between the copper foils and Al[SUB2]O[SUB3] ceramics; it is the key factor in influencing the performance of the DCB substrate. We also discuss how to get good microstructure of the DCB interface. [ABSTRACT FROM AUTHOR] |
| Databáze: |
Complementary Index |
| Externí odkaz: |
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