A hi-density C4/CBGA interconnect technology for a CMOS microprocessor.
| Autor: | Kromann, G.B., Gerke, R.D., Wayne Wei-Xi Huang |
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| Zdroj: | IEEE Transactions on Components, Packaging & Manufacturing Technology, Part B; 1996, Vol. 19 Issue 1, p166-173, 8p |
| Databáze: | Complementary Index |
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