Automated design tool for examining microelectronic packaging design alternatives.
| Autor: | Siew-Wei Chin, Rajan, S.D., Nagaraj, B.K., Mahalingam, M. |
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| Zdroj: | IEEE Transactions on Components, Packaging & Manufacturing Technology, Part B; 1994, Vol. 17 Issue 1, p76-82, 7p |
| Databáze: | Complementary Index |
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