Minimizing damage and contamination in RIE processes by extracted-plasma-parameter analysis.
Autor: | Yamashita, T., Hasaka, S., Natori, I., Fukui, H., Ohmi, T. |
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Zdroj: | IEEE Transactions on Semiconductor Manufacturing; 1992, Vol. 5 Issue 3, p223-233, 11p |
Databáze: | Complementary Index |
Externí odkaz: |