In-situ prediction of reactive ion etch endpoint using neural networks.
| Autor: | Baker, M.D., Himmel, C.D., May, G.S. |
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| Zdroj: | IEEE Transactions on Components, Packaging & Manufacturing Technology, Part A; 1995, Vol. 18 Issue 3, p478-483, 6p |
| Databáze: | Complementary Index |
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