Use of the three-dimensional TLM method in the thermal simulation and design of semiconductor devices.
| Autor: | Gui, X., Webb, P.W., Gao, G.B. |
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| Zdroj: | IEEE Transactions on Electron Devices; 1992, Vol. 39 Issue 6, p1295-1302, 8p |
| Databáze: | Complementary Index |
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