Optical transceiver ICs based on 3D die-stacking of opto-electronic devices.

Autor: Duan, P., Raz, O., Smalbrugge, B. E., van de Plassche, Karel, Dorren, H.J.S
Zdroj: 2013 IEEE Photonics Conference; 2013, p515-516, 2p
Databáze: Complementary Index