Optical transceiver ICs based on 3D die-stacking of opto-electronic devices.
Autor: | Duan, P., Raz, O., Smalbrugge, B. E., van de Plassche, Karel, Dorren, H.J.S |
---|---|
Zdroj: | 2013 IEEE Photonics Conference; 2013, p515-516, 2p |
Databáze: | Complementary Index |
Externí odkaz: |