Fin bending due to stress and its simulation.
| Autor: | Gencer, Alp H., Tsamados, Dimitrios, Moroz, Victor |
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| Zdroj: | 2013 International Conference on Simulation of Semiconductor Processes & Devices (SISPAD); 2013, p109-112, 4p |
| Databáze: | Complementary Index |
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