A three-dimensional high-throughput architecture using through-wafer optical interconnect.
| Autor: | Wills, D.S., Lacy, W.S., Camperi-Ginestet, C., Buchanan, B., Cat, H.H., Wilkinson, S., Lee, M., Jokerst, N.M., Brooke, M.A. |
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| Zdroj: | Journal of Lightwave Technology; 1995, Vol. 13 Issue 6, p1085-1092, 8p |
| Databáze: | Complementary Index |
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