The correlation of shear stress and metal shift: a modeling approach [packaging].

Autor: Kelly, G., Lyden, C., O'Mathuna, C., Slattery, O., Hayes, T., Exposito, J.
Zdroj: Proceedings of IEEE 43rd Electronic Components & Technology Conference (ECTC '93); 1993, p264-269, 6p
Databáze: Complementary Index