X-ray diffraction study of copper-time intermetallic compounds on solder-coated PC boards.
| Autor: | Hong, J., Chason, M. |
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| Zdroj: | Fifth IEEE/CHMT International Electronic Manufacturing Technology Symposium, 1988, 'Design-to-Manufacturing Transfer Cycle; 1988, p149-154, 6p |
| Databáze: | Complementary Index |
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