Recent advances in surface and thin film analysis methods for application to packaging problems.
| Autor: | Von Criegern, R., Budde, K., Hoesler, W., Holzapfel, W. |
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| Zdroj: | Proceedings of the 1997 1st Electronic Packaging Technology Conference (Cat No97TH8307); 1997, p270-276, 7p |
| Databáze: | Complementary Index |
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