RBS measurement of the thickness of nanometer oxide layers: Adhesion strength between copper leadframe and molding compound correlated with the oxide layer thickness.
| Autor: | Schmidt, R., Hosler, W., Tilgner, R. |
|---|---|
| Zdroj: | Proceedings of the 1997 1st Electronic Packaging Technology Conference (Cat No97TH8307); 1997, p188-193, 6p |
| Databáze: | Complementary Index |
| Externí odkaz: |
|