Thermal dissipation characteristics of a non-hermetic metal dual in-line package.
| Autor: | Pasqualoni, A., Crane, J., DiOrio, M. |
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| Zdroj: | Fourth Annual IEEE Semiconductor Thermal & Temperature Measurement Symposium; 1988, p67-77, 11p |
| Databáze: | Complementary Index |
| Externí odkaz: |
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