Three dimensional metallization for vertically integrated circuits.
| Autor: | Bollmann, D., Braun, R., Buchner, R., Cao-Minh, U., Engelhardt, M., Errmann, G., Grabl, T., Hieber, K., Hubner, H., Kawala, G., Kleiner, M., Klumpp, A., Kuhn, S., Landesberger, C., Lezec, H., Muth, W., Pamler, W., Popp, R., Renner, E., Ruhl, G. |
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| Zdroj: | European Workshop Materials for Advanced Metallization,; 1998, p94-98, 5p |
| Databáze: | Complementary Index |
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