A Premetal BPSG Filled Deep Trench Isolation Technology for ECL-BiCMOS LSIs using CMP.
Autor: | Yoshida, Hiroshi, Suzuki, Hisamitsu, Kinoshita, Yasushi, Imai, Kiyotaka, Akimoto, Takeshi, Tokashiki, Ken, Madihian, Mohammad, Yamazaki, Tohru |
---|---|
Zdroj: | ESSDERC '95: Proceedings of the 25th European Solid State Device Research Conference; 1995, p367-370, 4p |
Databáze: | Complementary Index |
Externí odkaz: |