A Premetal BPSG Filled Deep Trench Isolation Technology for ECL-BiCMOS LSIs using CMP.

Autor: Yoshida, Hiroshi, Suzuki, Hisamitsu, Kinoshita, Yasushi, Imai, Kiyotaka, Akimoto, Takeshi, Tokashiki, Ken, Madihian, Mohammad, Yamazaki, Tohru
Zdroj: ESSDERC '95: Proceedings of the 25th European Solid State Device Research Conference; 1995, p367-370, 4p
Databáze: Complementary Index