A Comparison of Trench Filling Materials for Sub-Micron CMOS.
| Autor: | Bolbot, P.H., Roberts, M.C., Medhurst, P.L. |
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| Zdroj: | ESSDERC '88: 18th European Solid State Device Research Conference; 1988, pc4-c540, 1071p |
| Databáze: | Complementary Index |
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