The Characteristic Wearout Process in Epoxy-Glass Printed Circuits for High Density Electronic Packaging.
Autor: | Lahti, J. N., Delaney, R. H., Hines, J. N. |
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Zdroj: | 17th International Reliability Physics Symposium; 1979, p39-43, 5p |
Databáze: | Complementary Index |
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