A novel MCM package for RF applications.
| Autor: | Degani, Y., Dudderar, T.D., Frye, R.C., Gregus, J.A., Jacala, J.J., Kossives, D., Lau, M.Y., Low, Y., Smith, P.R., Tai, K.L. |
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| Zdroj: | Twenty Third IEEE/CPMT International Electronics Manufacturing Technology Symposium (Cat No98CH36205); 1998, p225-231, 7p |
| Databáze: | Complementary Index |
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