Surface contamination of bonding pads incapable of Au wire bonding.
| Autor: | Watanabe, M., Tabuse, K. |
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| Zdroj: | Twenty Third IEEE/CPMT International Electronics Manufacturing Technology Symposium (Cat No98CH36205); 1998, p187-193, 7p |
| Databáze: | Complementary Index |
| Externí odkaz: |
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