Alternative solders for flip chip applications in the automotive environment.
| Autor: | Jung, E., Heinricht, K., Kloeser, J., Aschenbrenner, R., Reichl, H. |
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| Zdroj: | Twenty Second IEEE/CPMT International Electronics Manufacturing Technology Symposium IEMT-Europe 1998 Electronics Manufacturing & Development for Automotives (Cat No98CH36204); 1998, p82-91, 10p |
| Databáze: | Complementary Index |
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