Thick-film intelligent sensors using new Du Pont and ESL high technology materials.

Autor: Fitt, J., Gondek, J.J., Parzelka, Z., Zaraska, W.
Zdroj: Twenty First IEEE/CPMT International Electronics Manufacturing Technology Symposium Proceedings 1997 IEMT Symposium; 1997, p196-200, 5p
Databáze: Complementary Index