Pb-free Soldering Alternatives For Fine Pitched Electronics Packaging.
| Autor: | Felton, L.E., Raeder, C.H., Havasy, C.K., Knorr, D.B. |
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| Zdroj: | Thirteenth IEEE/CHMT International Electronics Manufacturing Technology Symposium; 1992, p300-304, 5p |
| Databáze: | Complementary Index |
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