Outer Lead Bonding Process Conditions For TFT-LCD Module.
| Autor: | Dyi-Chung Hu, Shyuan-Jeng Ho, Bao-Yun Tang |
|---|---|
| Zdroj: | Thirteenth IEEE/CHMT International Electronics Manufacturing Technology Symposium; 1992, p277-282, 6p |
| Databáze: | Complementary Index |
| Externí odkaz: |
|