Lead On Chip TSOP Assembly Process For Fast Sram With Peripherally Located Bond Pads.
| Autor: | Hagen, D., McDermott, J., Bigler, J., Cavasin, D., Primeaux, F., Ziep Tran, Afshar, D. |
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| Zdroj: | Thirteenth IEEE/CHMT International Electronics Manufacturing Technology Symposium; 1992, p39-47, 9p |
| Databáze: | Complementary Index |
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