A fully-packaged electromagnetic microrelay.
Autor: | Tilmans, H.A.C., Fullin, E., Ziad, H., Van de Peer, M.D.J., Kesters, J., Van Geffen, E., Bergqvist, J., Pantus, M., Beyne, E., Baert, K., Naso, F. |
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Zdroj: | Technical Digest IEEE International MEMS 99 Conference Twelfth IEEE International Conference on Micro Electro Mechanical Systems (Cat No99CH36291); 1999, p25-30, 6p |
Databáze: | Complementary Index |
Externí odkaz: |