A fully-packaged electromagnetic microrelay.

Autor: Tilmans, H.A.C., Fullin, E., Ziad, H., Van de Peer, M.D.J., Kesters, J., Van Geffen, E., Bergqvist, J., Pantus, M., Beyne, E., Baert, K., Naso, F.
Zdroj: Technical Digest IEEE International MEMS 99 Conference Twelfth IEEE International Conference on Micro Electro Mechanical Systems (Cat No99CH36291); 1999, p25-30, 6p
Databáze: Complementary Index