Integration of an in situ RIE preclean with a CVD tungsten silicide deposition process.
Autor: | Nowicki, R.S., Geraghty, P., Fuhs, C. |
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Zdroj: | Seventh International IEEE Conference on VLSI Multilevel Interconnection; 1990, p462-467, 6p |
Databáze: | Complementary Index |
Externí odkaz: |