Step coverage prediction in plasma-enhanced deposition of silicon dioxide from TEOS.
| Autor: | Raupp, G.B., Cale, T.S., Hey, H.P.W. |
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| Zdroj: | Proceedings, Sixth International IEEE VLSI Multilevel Interconnection Conference; 1989, p488-488, 1p |
| Databáze: | Complementary Index |
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