Adhesive flip chip bonding in a miniaturised spectrometer.
| Autor: | Rusanen, O., Keranen, K., Blomberg, M., Lehto, A. |
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| Zdroj: | Proceedings The First IEEE International Symposium on Polymeric Electronics Packaging, PEP '97 (Cat No97TH8268); 1997, p95-100, 6p |
| Databáze: | Complementary Index |
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