AT&T spl mu/Surface Mount Assembly: A New Technology for the Large Volume Fabrication of Cost Effective Flip-Chip MCMs.
| Autor: | Dudderar, T.D., Degani, Y., Spadafora, J.G., Tai, K.L., Frye, R.C. |
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| Zdroj: | Proceedings of the International Conference on Multichip Modules; 1994, p266-272, 7p |
| Databáze: | Complementary Index |
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