PVD aluminum dual damascene interconnection: yield comparison between counterbore and self aligned approaches.
Autor: | Blosse, A., Raghuram, U., Thekdi, S., Koutny, B., Lau, G., Koh, S.L., Goodenough, C., Pouedras, T., Sethuraman, A., Geha, S., Chowdhury, T., Guggilla, S., Krishna, N., Su, J., Cha, C., Yao, G., Price, J.B. |
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Zdroj: | Proceedings of the IEEE 1999 International Interconnect Technology Conference (Cat No99EX247); 1999, p215-217, 3p |
Databáze: | Complementary Index |
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