A high aspect ratio sub 0.2 micron Al plug technology for 0.13 /spl mu/m generation.
| Autor: | Tsung-Ju Yang, Tzu-Kun Ku, Tze-Liang Lee, Bing-Yue Tsui, Lai-Juh Chen, Chin Hsia |
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| Zdroj: | Proceedings of the IEEE 1999 International Interconnect Technology Conference (Cat No99EX247); 1999, p209-211, 3p |
| Databáze: | Complementary Index |
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