Cleans for Al vias in a 0.175 /spl mu/m dual damascene process.
| Autor: | Gambino, J., Clevenger, L., Costrini, G., Schnabel, F., Ravikumar, R., Dobuzinsky, D., Iggulden, R., Dziobkowski, C., Wildman, H., Benedict, J., Bruley, J., Domenicucci, A. |
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| Zdroj: | Proceedings of the IEEE 1999 International Interconnect Technology Conference (Cat No99EX247); 1999, p206-208, 3p |
| Databáze: | Complementary Index |
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