Post etch cleaning of dual damascene system integrating copper and SiLK/sup TM/.
| Autor: | Louis, D., Peyne, C., Arvet, C., Lajoinie, E., Maloney, D., Lee, S. |
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| Zdroj: | Proceedings of the IEEE 1999 International Interconnect Technology Conference (Cat No99EX247); 1999, p103-105, 3p |
| Databáze: | Complementary Index |
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