Copper dual damascene wiring for sub-0.25 /spl mu/m CMOS technology.
Autor: | Heidenreich, J., Edelstein, D., Goldblatt, R., Cote, W., Uzoh, C., Lustig, N., McDevitt, T., Stamper, A., Simon, A., Dukovic, J., Andricacos, P., Wachnik, R., Rathore, H., Katsetos, T., McLaughlin, P., Luce, S., Slattery, J. |
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Zdroj: | Proceedings of the IEEE 1998 International Interconnect Technology Conference (Cat No98EX102); 1998, p151-153, 3p |
Databáze: | Complementary Index |
Externí odkaz: |