Effect of cleaning and non-cleaning situations on the reliability of flip-chip packages.
| Autor: | Wang, J., Zou, D., Qian, Z., Ren, W., Liu, S., Dudderar, T.D., Sullivan, P.A. |
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| Zdroj: | Proceedings of 3rd International Conference on Adhesive Joining & Coating Technology in Electronics Manufacturing 1998 (Cat No98EX180); 1998, p211-219, 9p |
| Databáze: | Complementary Index |
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