Chip bumping for rework on FCOB assembly line.
| Autor: | Yang, Z., Viswanadam, G., Tay, Y.H. |
|---|---|
| Zdroj: | Proceedings of 2nd Electronics Packaging Technology Conference (Cat No98EX235); 1998, p25-29, 5p |
| Databáze: | Complementary Index |
| Externí odkaz: |
|
| Autor: | Yang, Z., Viswanadam, G., Tay, Y.H. |
|---|---|
| Zdroj: | Proceedings of 2nd Electronics Packaging Technology Conference (Cat No98EX235); 1998, p25-29, 5p |
| Databáze: | Complementary Index |
| Externí odkaz: |
|