Fine geometry and fine pitch bumping process.
| Autor: | Viswanadam, G., Sathappan, S. |
|---|---|
| Zdroj: | Proceedings of 2nd Electronics Packaging Technology Conference (Cat No98EX235); 1998, p18-24, 7p |
| Databáze: | Complementary Index |
| Externí odkaz: |
|
| Autor: | Viswanadam, G., Sathappan, S. |
|---|---|
| Zdroj: | Proceedings of 2nd Electronics Packaging Technology Conference (Cat No98EX235); 1998, p18-24, 7p |
| Databáze: | Complementary Index |
| Externí odkaz: |
|